Customization: | Available |
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Type: | Piezoresistive Pressure Sensor |
Manufacturer: | Honeywell |
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CHARACTERISTIC | MIN. | TYP. | MAX. | UNIT | ||||||
TBP SERIES | ||||||||||
Supply voltage (Vsupply)1, 2 | 1.5 | 5.0 | 12.0 | Vdc | ||||||
Supply current (at 5.0 Vdc supply) | - | 0.6 | 1 | mA | ||||||
Operating temperature range3 | -40 [-40] | - | 125 [257] | °C [°F] | ||||||
Compensated temperature range4 | 0 [32] | 85 [185] | °C [°F] | |||||||
Output resistance | - | 2.5 | - | kOhm | ||||||
NBP SERIES | ||||||||||
Supply voltage (Vsupply)1, 2 | 1.8 | 5.0 | 12.0 | Vdc | ||||||
Supply current (at 5.0 Vdc supply) | - | 1.5 | 2.5 | mA | ||||||
Specified temperature range5 | -40 [-40] | - | 125 [257] | °C [°F] | ||||||
Accuracy6 | ±0.25 | %FSS BFSL7 | ||||||||
Input resistance | 2.4 | 3.0 | 5.5 | kOhm | ||||||
Thermal effect on resistance (TER)8 | 1200 | - | 3200 | ppm/°C |
PRESSURE TYPE | DESCRIPTION | |||||||||
Absolute | Output is proportional to the difference between applied pressure and a built-in reference to vacuum. Reference pressure is absolute zero pressure (full vacuum). |
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Differential | Output is proportional to the difference between the pressures applied to each port (Port 1 - Port 2). | |||||||||
Gage | Output is proportional to the difference between applied pressure and atmospheric (ambient) pressure. Reference pressure is atmospheric pressure. |
CHARACTERISTIC | MIN. | MAX. | ||||||
Supply voltage (Vsupply) Storage temperature |
-12.0 | 12.0 | ||||||
-40 [-40] | 125 [257] | |||||||
Soldering time and temperature: lead solder temperature (DIP) |
4 s max. at 250°C [482°F] | |||||||
peak reflow temperature (SMT, Leadless SMT) | 15 s max. at 250°C [482°F] |
CHARACTERISTIC | PARAMETER | ||||
Humidity: all external surfaces internal surfaces of silicone gel coating option internal surfaces of no gel coating option |
0 %RH to 95 %RH, non-condensing 0 %RH to 100 %RH, condensing 0 %RH to 95 %RH, non-condensing |
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Vibration | MIL-STD-202G, Method 204D, Condition B (15 g, 10 Hz to 2 kHz) | ||||
Shock | MIL-STD-202G, Method 213B, Condition C (100 g, 6 ms duration) | ||||
Life1 | 1 million pressure cycles min. | ||||
ESD | MIL-STD-883 Method 3015.7 | ||||
Solder reflow | J-STD-020E, MSL 2 (see shelf/floor life) | ||||
Shelf life | Unlimited storage life, inside sealed moisture barrier bag | ||||
Floor life2 | 1 year floor life, after removal from sealed moisture bag, <30°C & <60 %RH |
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Certification (silicone gel coating option: Port 1 only) | NSF- 169, BPA Free, LFGB |
COMPONENT | PRESSURE PORT 1 (P1) | PRESSURE PORT 2 (P2) | |||
NO GEL COATING IN MEDIA PATH | SILICONE GEL COATING IN MEDIA PATH (FOOD GRADE) |
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Ports and covers | high temperature polyamide | ||||
Substrate | alumina ceramic | - | alumina ceramic | ||
Adhesives | epoxy, silicone | epoxy, silicone gel | epoxy, silicone | ||
Electronic components |
silicon, gold, glass, solder, aluminum | 304SST | silicon |
Description | Product Attribute |
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Manufacturer | Honeywell |
Product Category | Board Mount Pressure Sensors |
Pressure Type | Gage |
Operating Pressure | 0 psi to 150 psi |
Accuracy | 0.25 % |
Output Type | Analog |
Mounting Style | Through Hole |
Operating Supply Voltage | 5 Vdc Typ. |
Package / Case | Leadless SMT |
Minimum Operating Temperature | - 40 °C |
Maximum Operating Temperature | + 125 °C |
Series | TBP Series |